X-ray is now one of the most efficient and quick methods to detect and analyze product internal structures and flaws in a non-destructive testing.
more about x-ray
X-ray is very powerful in penetrating objects. The level of penetration varies with the density of the substance contained in an object structure. The X-ray receives images based on the amount of penetrated energy.
The Superiority Of LF
The Superiority of LF
The Superiority of LF
Fast delivery
The higher-end equipment in the industry
Professional analysis ability
Accompany customer to perform testing
Case Sharing
IC
BGA
PCBA
PCB
Passive Device
IC
IC – detachment of first bond pad
IC – crack in second bond pad
IC – wire damage
BGA
BGA – solder rejection
BGA – solder short
PCBA
PCBA – poor soldering of through hole
PCB
PCB – internal circuit crack
Passive Device
Passive device – inductor and its metal layer crack
Application
Defect inspection in IC packaging: layer delamination, burst crack, void, and bonding inspection.
Potential defects in the PCB manufacturing process E.g.: misalignment, bridge or open circuit.
SMT soldering void inspection and measurement.
Defect inspection of open, short or abnormal connections in the interconnect.
Solder ball array inspection in BGA packaging and flip chip packaging.
Inspection of crack in high density plastic material or void in metal.