Metallic wires are employed to connect chip and lead frame during IC assembling which may suffer inadequate strength and pollution. This test is aimed at verifying joint force by testing wire bond pull and shear to ensure resistance of packed IC against external stress.
What we can do
Lab First may is capable of testing aluminum, gold, and copper wires of diameter up to 0.8mil.
case sharing
Wire bond shear test
Wire bond pull test
The Superiority of LF
Reference Specification
The Superiority of LF
Assist customer in making customized fixture and jig
Assist customer to fulfill urgent orders the same da
Reference Specification
MIL-STD-883 METHOD 2011.7
JESD22-B11
Equipment Capacity
Application
Equipment Capacity
Brand: DAGE
Model: DAGE 4000
Specification: Shear force up to 100kg and pull 5k
Application
IC assembly process
Why Choose Lab First
One-stop service (chemical analysis/failure analysis/material analysis)