Wire Bonding Integrity

Metallic wires are employed to connect chip and lead frame during IC assembling which may suffer inadequate strength and pollution. This test is aimed at verifying joint force by testing wire bond pull and shear to ensure resistance of packed IC against external stress.

What we can do

  • Lab First may is capable of testing aluminum, gold, and copper wires of diameter up to 0.8mil.

case sharing

Wire bond shear test
Wire bond shear test
Wire bond pull test
Wire bond pull test

Why Choose Lab First


One-stop service (chemical analysis/failure analysis/material analysis)

Precise and quantitative analysis

Full experimental data interpretation

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