IC Top Marking is seen clearly at low level of magnification.
In extremely low impedance of short-circuit samples, InGaAs & OBIRCH are unable to detect the hot spot. Yet Thermal EMMI successfully images the hot spot, with coordinates of the hot spot measured for future delayering or cross-section positioning.
IC defect can be clearly shown by hot spot imaging without de-capsulation of the IC, clarifying whether it is a die defect or packaging defect.
Short-circuit in PCB can also be revealed by hot spot imaging.