Solder Ball Integrity
Device manufacturers often find it hard to determine whether customer’s complaints on IC packaging are caused by poor soldering process at the finished goods assembly or poor quality of BGA solder ball. Therefore, it is good to run a solder ball test over BGA/WLCSP packaged ICs before shipment to verify the solderability of solder balls.
What we can do
- LF may provide the same flux and reflow conditions employed by the customer end production line to test solderability of BGA solder balls with simulated process. This not only assesses BGA wetting quality accurately but also reveals quickly failure conditions of defected devices so that defects can be remedied in time.
Failure Mode
The Superiority of LF
Reference Specification
The Superiority of LF
LF’s tech partner,iST, now offers printed circuit plates of various sizes for the BGA solderability tests together with provision of different carrier plates or ceramic plates to deliver optimal services to minimize nuisances in test material preparation.
Reference Specification
- MIL-STD
- IPC J-STD-002
Why Choose Lab First
One-stop service (chemical analysis/failure analysis/material analysis)
Precise and quantitative analysis
