Solder Ball Integrity

Device manufacturers often find it hard to determine whether customer’s complaints on IC packaging are caused by poor soldering process at the finished goods assembly or poor quality of BGA solder ball. Therefore, it is good to run a solder ball test over BGA/WLCSP packaged ICs before shipment to verify the solderability of solder balls.

What we can do

  • LF may provide the same flux and reflow conditions employed by the customer end production line to test solderability of BGA solder balls with simulated process. This not only assesses BGA wetting quality accurately but also reveals quickly failure conditions of defected devices so that defects can be remedied in time.

Failure Mode

3D OM image of BGA solder non-wetting
X-Ray image of BGA solder non-wetting

Why Choose Lab First

One-stop service (chemical analysis/failure analysis/material analysis)

Precise and quantitative analysis

Full experimental data interpretation


Ready to pursue your goal