Transmission Electron Microscopy(TEM)
What we can do
TEM is capable of analysis of fine structures, crystalline defects, and chemical compositions of materials, which is also equipped with EDS, HAADF (ZC), and stress analysis, which can acquire structural and compositional information on atomic scales to address various process issues for the clients.
What is TEM?

TEM (Transmission Electron Microscopy) is an analysis device for observation the micro structure of material and lattice defects. By imaging ultra-thin sample with high-energy electron beams, its resolution is down to 0.1nm (the scale of atom).
The Superiority Of LF
- Micro Structure Analysis (Lattice Image).
- Crystalline Defect Analysis.
- Element Ingredient Analysis.
- Thin Film Stress Analysis.
- Electron Diffraction Analysis.
- Impurity And Pollutant Analysis.
- Market-leading TEM analysis technique has hit the 5nm technology node.
- Fast delivery: operating 24 hours a day by 3 shifts.
- The cutting-edge TEM equipment of FEI, JEOL for your selection.
- The power of TEM sample preparations: iST installs total 8 FEI Helios 660 Dual-beam FIB, which is the advanced model in industry and dedicated to working with the new ion polishing tool that can effectively eliminate sample damage (with energy of ion beam as low as 500eV), which can produce TEM images of high quality.
- Semiconductor Industry
- LED Industry
- Optoelectronics Industry
- MEMS Industry
Equipment Capacity

FEI Talos-F200
Image | TEM resolution: 0.1nm |
EDS | Detector: SDD 30 mm2 x 4 |
Other functions | Piezo stage + DCFI |

JEOL JEM-2800F
Image | TEM resolution: 0.1nm |
EDS | Detector: SDD 100 mm2 x 2 |
Other functions | Strain mapping |

JEOL JEM-2100F
Image | TEM resolution: 0.1nm |
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