♦ FIB circuit:

IC circuit edit is provided to the designers through FIB. Due to the merit of saving a photo mask redo, FIB significantly shortens time for IC prototype validation and time-to-market.

 ♦ CAD Probe Pad:

Using FIB, the points where signals must be measured are led to the surface of the IC so that a mechanical prober may retrieve internal signals in the IC.

 ♦ Backside FIB Circuit Edit:

Modifying a circuit from the backside is easier and has a higher success rate due to the limited flip-chip packaging substrate, advanced process continuously edging into 5nm, increasing metal winding layers, and more complex and compact circuits.