FAILURE ANALYSIS
Time is the key to seizing the business opportunity, thus short development cycle time is critical to IC design houses.
But with over 100 IC failure modes, how to select the most valid tools? How to interpret analysis results to determine better approaches in production? Our Failure Analysis service identifies the design bugs and perform real-time circuit defect repair and edit (on machine).
Service items
Electrical Characteristics Measurement
- I-V Curve Measurement
- Auto Curve Tracer (ACT)
- Nano Probe
- Probe Measurement
- TLP Measurement of ESD Protection Devices
Non-Destructive Analysis
- 3D OM
- Scanning Acoustic Tomography (SAT)
- X-ray Inspection (2D X-ray)
- High Resolution 3D X-Ray Microscope
Sample Preparation
- IC Decapsulation
- IC Delayer
- Cross-Section & Backside Polish
- Ion Beam Cross-Section Polisher (CP)
Defect Detection
- Emission Microscope (EMMI)
- InGaAs EMMI
- Optical Beam Induced Resistance Change (OBIRCH)
- Thermal EMMI (InSb)
Competitive Analysis
- IC Structure / Competitive Analysis