Wafer Dicing Saw

What we can do

LF provides wafer dicing services. This facing dual-spindle dicing function not only gives quality dicing for both front and back sides but also offers high-quality dicing service with extra atomizing nozzle two-phase mixture fluid washing for CMOS sensors and other devices which mandate greater cleanness.

 

The Superiority Of LF

Why is Wafer Dicing needed?

A2-1-1-1

Dice or groove wafer or components in preparation for subsequent manufacturing or functional tests. 

Case Sharing

why choose lab first


The FIB third-party lab in the world

Reach to 5nm process

over 23 FIBs

LAB FIRST IS YOUR FIRST CHOICE

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