Surface Mount Technique (SMT)
What we can do
The surface mount technology (SMT) process is the very first factor affecting BLR tests. The quality of ICs mounted on simulation PCBs will determine the accuracy of product life cycle assessment. Key factors on quality are solder paste features, printing settings (such as stripping distance, stripping time, and printing speed), placement accuracy, and selecting of steel plate.
The Superiority Of LF
- Profound SMT experience to ensure consistent and high-yield sample preparation
- Provide Design For Manufacture (DFM) consultancy service to tackle each and every user-end issues
- SMT process capacity reaches to pitch 0.15 mm; component dimension reaches to 0.3mm x 0.15mm. Easy to cope with the micro-scale of IC size and fine pitch.
- Acts as a fair third party between the purchasing and supply side to jointly monitor quality
Before Reflow → After Reflow