Surface Mount Technique (SMT)
What we can do
The surface mount technology (SMT) process is the very first factor affecting BLR tests. The quality of ICs mounted on simulation PCBs will determine the accuracy of product life cycle assessment. Key factors on quality are solder paste features, printing settings (such as stripping distance, stripping time, and printing speed), placement accuracy, and selecting of steel plate.
The Superiority Of LF
The fully-automatic SMT production line of LF not only provides small-scale mass production services, but also assists you in custom-made test samples. This reduces test variables by cutting sample delivery time and eliminates damage that may occur when moving samples back and forth.
The fully-automatic SMT production line of LF not only provides small-scale mass production services, but also assists you in custom-made test samples. This reduces test variables by cutting sample delivery time and eliminates damage that may occur when moving samples back and forth.
- Profound SMT experience to ensure consistent and high-yield sample preparation
- Provide Design For Manufacture (DFM) consultancy service to tackle each and every user-end issues
- SMT process capacity reaches to pitch 0.15 mm; component dimension reaches to 0.3mm x 0.15mm. Easy to cope with the micro-scale of IC size and fine pitch.
- Acts as a fair third party between the purchasing and supply side to jointly monitor quality
Case Sharing
Quality Monitor of Reflow-1
Quality Monitor of Reflow-2
Quality Monitor of Reflow-1
Before Reflow → After Reflow
Quality Monitor of Reflow-2
Before Reflow → After Reflow
why choose lab first
The FIB third-party lab in the world
short cycle time
