IC Wire Bonding / Assembly

What we can do

LF is capable of meeting engineering requirements regarding IC wire bonding and assembly, from rework, to wire patch-up, to engineering sample preparation, through to total project development.

A die must be linked with the substrate to fulfill its intended function; a wire bonding is to connect the signal from a die to the substrate.

The Superiority Of LF

Case Sharing

why choose lab first


The FIB third-party lab in the world

Expert Team

Perfect Advanced Equipment

LAB FIRST IS YOUR FIRST CHOICE

Ready to pursue your goal