Die Bonding

What we can do

The die bonding service LF provides including, die sorting, adhesive die bonding, flip chip bonding, and eutectic die bonding, etc.

Use various processes such as adhesive, thermal, compression or ultrasonic to bond the dies or components on the specified materials for subsequent wire bonding or function test.

The Superiority Of LF

Case Sharing

why choose lab first


The FIB third-party lab in the world

Expert Team

Perfect Advanced Equipment

LAB FIRST IS YOUR FIRST CHOICE

Ready to pursue your goal