Die Bonding
What we can do
The die bonding service LF provides including, die sorting, adhesive die bonding, flip chip bonding, and eutectic die bonding, etc.
Use various processes such as adhesive, thermal, compression or ultrasonic to bond the dies or components on the specified materials for subsequent wire bonding or function test.
The Superiority Of LF
Application
Superiority
Application Industry
Equipment Capacity
Application
- Wafer frame pick up and place waffle pack sorting
- Wafer frame pick up and place wafer frame
- Wafer map die sorting
- Die flip sorting
- Adhesive dispensing and die bonding
- Thermocompression die bonding
- High precision die bonding process
- Flip chip die bonding
- Eutectic die bonding
Superiority
LF offers packaging process such as die sawing, die bonding, and wire bonding, following up with one-stop solution of high quality verification and analyses to effectively shorten the sample preparation time.
Application Industry
- Semiconductor industry
- LED industry
- Optoelectronics industry
- MEMS industry
Equipment Capacity
Tresky T-8000
XYZ axis | ±5μm @ |
Die size | 0.8~35 |
Bond force | 20~2500 |
Heading | 350 |
Bond head | 350 |
Flip | 0.8~15 |
Gel-packs(inch) | 2、4 |
Waffle | 2、4 |
Wafer ring | 4、6、8 |
Wafer | 6、8、12 |
Case Sharing
Adhesive Die Bonding
Eutectic Die Bonding
Die Sorting
Adhesive Die Bonding


Eutectic Die Bonding



Die Sorting




why choose lab first

The FIB third-party lab in the world

Expert Team
