Engineering Sample Preparation
The sample preparation techniques play a key role in determining function test accuracy and flaw identification easiness. Aim at sample preparation, iST provides the following services, including IC decapsulation, IC delayer, cross-section & backside grinding, cross-section polisher.
LF excellent SMT test sample preparation and fast assembly experience will assure good quality in later function tests and reliability tests.
Service items
Quick Assembly
- Grinding
- Wafer Dicing Saw
- Die Bonding
- IC Wire Bonding / Assembly
Surface Mount Technique (SMT)
- Surface Mount Technique (SMT)