Metal Evaporation Deposition for Backside Metallization
What we can do
Provide the customer with Metal Evaporation for Backside Metallization services which place metals on the backs of wafers with metal types and thicknesses subject to customer specification.
What need CHEMICAL / ELECTRO-LESS PLATING?
During the backside metallization (BM) of wafer thinning process, the Metal Evaporation for Backside Metallization heats up the desired target with electron beams in a high-vacuum environment to adhere vaporized targets to the heated surface of the wafer.
Electro-less Plating Process
The Superiority Of LF
Application
Superiority
Application
- Existing Metal Options: Ti / Ni / Ag, Ti / Ni / Ti / Ag, Ti / Ni / Ag / Ni, Ti / Ni / Ag / Sn With Thickness Subject To Customer Requirements.
- Applicable To 8″/6″ P- Or N-Type Wafers.
- Other Combinations Of Metals Available Through Joint Development With The Customer.
Superiority
- Using dual cryo-pumps to provide the high-vacuum environment for metal growth.
- Varieties of target options, tailor-made targets available on demand.
- Measurement after evaporation: the Alpha Stepper adopted by the industry for total thickness measurement and non-destructive XRF measurement of the thickness of individual metal layers in a multi-layer structure.
- Good metal adhesion via evaporation; the reliability verification under conditions of 85oC temperatures, 85% relative humidity, and 500 hour exposure time show non-metal peeling.
- A team of engineers with diversified experts including front end wafer foundry, wafer thinning and backend packaging house, knowledgeable and experienced in process integration and analysis in phases from front through middle to back and well-prepared to assist customers in accelerated development, troubleshooting, and mass production stabilization.
Case Sharing
Non-Metal Peeling
Metal Evaporation Deposition
Non-Metal Peeling
Metal Evaporation Deposition
Rough surface wafers after evaporation: silvers adhered looks paper white
Why Choose Lab First
One-stop service integrating chemical analysis with failure analysis and material analysis
Backside silver thickness up to 15um
Automatic Manufacturing
Various solutions for front-side/backside metallization
