MOSFET Wafer Backend Process (BGBM)
After passing the WAT (Wafer Acceptance Test) in the front-end wafer foundry FAB. How to handle the wafer thinning and backside metallization (BGBM) before assembly?
Finally wafer thinning and backside metallization (BGBM) were finished, but you need to transport wafer to another suppliers for CP and sawing with high risk, is there any place to do it right one time?
Service items
MOSFET FRONT-SIDE METALLIZATION (FSM)
MOSFET BACKSIDE METALLIZATION (BM)
- Metal Evaporation Deposition for Backside Metallization
- Thick Ag Process
- Backside Metal Sputtering Deposition–Under Construction
- Electro-Plating–Under Construction
BACKEND PROCESS INTEGRATED SERVICES
- Chip Probing
- Laser Marking
- Vacuum Mounting
- Ring removal
- Die sawing
- Frame Probing
- Tape & Reel
- Final Test
Why Choose Lab First
One-stop service integrating chemical analysis with failure analysis and material analysis
Backside silver thickness up to 15um
Automatic Manufacturing
Various solutions for front-side/backside metallization
