The Package Assembly Integrity Test is a key test in automotive electronics reliability verification which covers Wire Bond Shear (WBS), Wire Bond Pull (WBP), Solderability (SD), Physical Dimensions (PD), and Solder Ball Shear (SBS), Lead Integrity (LI) according to specifications set by the Automotive Electronics Council (AEC). These verifications are required at automotive electronics IC packaging stage to enter any automotive electronics supply chain.
What we can do
iST helps your automotive electronics IC chips conform to AEC-Q100/AEC-Q101/AEC-Q104/AEC-Q200 specifications. iST is capable of helping automotive module makers to step into the supply chain of Tier-1 leading car manufacturers by meeting long life cycle and high reliability automotive requirements based on ISO 16750 automotive electronics environment test conditions.
Case Sharing
TDDB Solder Ball Shear (SBS)
Solderability (SD)
TDDB Solder Ball Shear (SBS)
TDDB Solder Ball Shear (SBS)
Solderability (SD)
Solderability (SD)
Reference Specification
Application
Reference Specification
JESD22-B100
JESD22-B105
JESD22-B108
AEC-Q100 /AEC-Q104
MIL-STD-883 Method 2011
Application
Automotive electronics
Why Choose Lab First
One-stop service (chemical analysis/failure analysis/material analysis)