Optical Beam Induced Resistance Change (OBIRCH)
What we can do
OBIRCH is normally used for high and low resistance analyses inside the chip, and current leak analysis of a circuit. OBIRCH enables effective locating of circuit defects such as cavities in metal wires, cavities under vias, high-resistance area at bottom of vias, etc., and detects short or current leak successfully as well.
What ORIRCH do?
The Optical Beam Induced Resistance Change (OBIRCH) scans an IC surface (either front or back) with a laser beam during the IC function test period. OBIRCH employs a laser beam to scan IC internal connection locations to generate a temperature gradient which then leads to resistance variance. It then identifies IC flaws by matching resistance variances.
The Superiority Of LF
Fast delivery. High efficiency. No need to do COB sample preparation by using backside probe.
Case Sharing
IC Front-side OBIRCH hot spot
IC Back-side OBIRCH hot spot
Application
- Metal/ poly/ well short
- Gate Oxide pin hole
- Metal via hole/ contact resistance failed
- Any IC failure (short/ bridge/ leakage/ high resistance associated with a differential material or its thickness
Machine limits
- Products with unstable output current are not suitable for OBIRCH detection.
Why Choose Lab First
One-stop service (chemical analysis/failure analysis/material analysis)
Precise and quantitative analysis
