IC Decapsulation
What we can do
Based on our long and profound experience, LF is able to provide the optimum decapping method specific to each individual packaged IC to prepare for easy testing. See below for some of the techniques we can offer. For more details please contact us at your convenience.
Package decap
LED, gallium arsenide IC, automotive IC, optical coupling IC
Special decap
Backside, MEMS, packaging material preparation, various kinds of packaging removal
Chemical etching analysis
Crater test, solder oil / stain removal, photo resistance removal by chemical etching, pin cleaning
What will need IC decapsulation
IC failure analysis may require looking into chips, wires, and devices which do not allow for observation of their internal parts because of the package covering outside. The external layers blocking observation may be removed by “dry etching” and “wet etching” to uncover the devices packaged inside for treatment and observation during testing.
The Superiority Of LF
- Comprehensive and experience-based assessments ensuring more successful follow-up tests
- Rich industry experience which ensures integrity of your samples
- PSolid service team which ensures your requirements can be met
Case Sharing
In spite of there being scores of packaging types, LF has adequate experience in dealing with any one of them.
led
Gallium arsenide IC
Automotive IC
Special decap is designed to ease the sample for later experiment which comes not only with chemical etching but also physical external forces.
Various kinds of packaging removal
Packaging material preparation
MEMS
Backside(keep the down bond)
Before crater test After crater test
Before solder oil / stain removal After solder oil / stain removal
Before photo resistance removal After photo resistance removal
Before pin cleaning After pin cleaning
Software Download
Why Choose Lab First
EXPERTS team
Joint diagnostics Service
