IC Decapsulation

What we can do

Based on our long and profound experience, LF is able to provide the optimum decapping method specific to each individual packaged IC to prepare for easy testing. See below for some of the techniques we  can offer. For more details please contact us at your convenience.

Package decap

LED, gallium arsenide IC, automotive IC, optical coupling IC

Special decap

Backside, MEMS, packaging material preparation, various kinds of packaging removal

Chemical etching analysis

Crater test, solder oil / stain removal, photo resistance removal by chemical etching, pin cleaning


What will need IC decapsulation

IC failure analysis may require looking into chips, wires, and devices which do not allow for observation of their internal parts because of the package covering outside. The external layers blocking observation may be removed by “dry etching” and “wet etching” to uncover the devices packaged inside for treatment and observation during testing.

The Superiority Of LF

Case Sharing

Software Download

Why Choose Lab First


Joint diagnostics Service

Perfect Advanced Equipment


Ready to pursue your goal