Moisture Sensitivity Level Test (MSL Test) is introduced to verify moisture sensitivity level of ICs, for avoiding shortened lifespan or damage resulting from IC delamination in SMT reflow assembly.
Device under test (DUT) should be subjected to “Initial Electric Characteristics Test”, “External Look Inspection”, and “Ultrasonic Inspection” to validate the initial status of the DUT (e.g. existence of delamination and cracks) before “baking out” at 125 ℃ for 24 hours followed by a “Dehumidification” and “Reflow” Test.
Moisture sensitivity level can vary greatly depending on the moisture conditions of the device, ranging from Level 1 to Level 6.
The testing conditions are defined into two categories: Sn-Pb Eutectic Assembly and Pb-Free Assembly, in accordance with the using reflow profile.
Failures mode includes the apparent damages, electrical failures, internal cracks and the position and ratio of delamination. In case the selected moisture sensitivity level fails the test, less strict conditions can be used for re-test. The final level identification shall be indicated on the outer package.
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